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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11315812 B1

PDFFull Text
Date of Patent:
Apr. 26, 2022

Filed:

Apr. 04, 2018

Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus

Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Jumpei Fujikata, Tokyo, JP;

Yuji Araki, Tokyo, JP;

Tensei Sato, Tokyo, JP;

Ryuya Koizumi, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:

BakerHostetler

Primary Examiner:

Douglas Kay

Int. Cl.
CPC ...
G05B 19/05 (2006.01); H01L 21/67 (2006.01); G05B 23/02 (2006.01); G05B 19/418 (2006.01); C25D 17/00 (2006.01); C25D 21/02 (2006.01); C25D 21/12 (2006.01); H01L 21/677 (2006.01); C25D 3/12 (2006.01); H01L 21/687 (2006.01); C25D 17/10 (2006.01); C25D 21/06 (2006.01); C25D 17/02 (2006.01); C25D 21/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67276 (2013.01); C25D 3/12 (2013.01); G05B 19/058 (2013.01); G05B 19/41875 (2013.01); G05B 23/02 (2013.01); G05B 23/0283 (2013.01); H01L 21/67057 (2013.01); H01L 21/67086 (2013.01); H01L 21/67242 (2013.01); H01L 21/67288 (2013.01); H01L 21/67751 (2013.01); H01L 21/68707 (2013.01); C25D 17/001 (2013.01); C25D 17/02 (2013.01); C25D 17/10 (2013.01); C25D 21/06 (2013.01); C25D 21/10 (2013.01); C25D 21/12 (2013.01); G05B 2219/2602 (2013.01);
Abstract

Provided is a semiconductor manufacturing apparatus, comprising: a first device; one or more sensors that detect physical quantities indicating a state of the first device; a first calculation circuit that calculates one or more feature quantities of the first device from the detected physical quantities; and a failure prediction circuit that monitors a temporal change in the one or more feature quantities calculated in the first calculation circuit, and stops receiving a new substrate when a duration for which a degree of deviation of the one or more feature quantities from those at a normal time is increasing exceeds a first time, and/or when a number of increases and decreases per unit time in the degree of deviation of the one or more feature quantities from those at the normal time exceeds a first number.

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