The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

Nov. 11, 2020
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Jumpei Fujikata, Tokyo, JP;

Masashi Shimoyama, Tokyo, JP;

Ryu Miyamoto, Tokyo, JP;

Kentaro Ishimoto, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/00 (2006.01); C25D 5/34 (2006.01); H01L 21/768 (2006.01); C23C 18/54 (2006.01); C25D 7/12 (2006.01); C25D 3/02 (2006.01); C25D 5/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C25D 5/34 (2013.01); C23C 18/54 (2013.01); C25D 3/02 (2013.01); C25D 5/022 (2013.01); C25D 7/12 (2013.01); C25D 7/123 (2013.01); C25D 17/001 (2013.01); H01L 21/6723 (2013.01); H01L 21/76873 (2013.01);
Abstract

A plating method for plating a substrate having resist opening portions is provided. The plating method includes a resist residue removing step of removing resist residues in the resist opening portions of the substrate by spraying first process liquid to a surface of the substrate on which the resist opening portions are formed, a liquid filling step of soaking the substrate passed through the removing step in second process liquid to fill the resist opening portions of the substrate with the second process liquid, and a plating step of plating the substrate passed through the liquid filling step.


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