The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2021

Filed:

Apr. 02, 2019
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Jumpei Fujikata, Tokyo, JP;

Masashi Shimoyama, Tokyo, JP;

Yoichi Nakagawa, Tokyo, JP;

Yoshitaka Mukaiyama, Tokyo, JP;

Yoshio Minami, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/00 (2006.01); C25D 5/02 (2006.01); C25D 17/06 (2006.01); C25D 17/10 (2006.01);
U.S. Cl.
CPC ...
C25D 17/008 (2013.01); C25D 5/022 (2013.01); C25D 17/001 (2013.01); C25D 17/06 (2013.01); C25D 17/10 (2013.01);
Abstract

A plating apparatus according to the present disclosure includes an anode holder configured to hold an anode; a substrate holder placed opposite the anode holder and configured to hold a substrate; and an anode mask installed on a front face of the anode holder and provided with a first opening adapted to allow passage of an electric current flowing between an anode and the substrate. The diameter of the first opening in the anode mask is configured to be adjustable. When a first substrate is plated, a diameter of the first opening is adjusted to a first diameter. When a second substrate is plated, the diameter of the first opening is adjusted to a second diameter smaller than the first diameter.


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