Makoto Fukushima

Title: Makoto Fukushima: Innovations in Polishing Technology

Introduction:

Makoto Fukushima, an accomplished inventor and engineer based in Tokyo, JP, has made significant contributions to the field of polishing technology. With an impressive portfolio of 61 patents to his name, Fukushima's ingenuity and expertise have revolutionized the realm of substrate polishing. This article explores some of his recent patents, his affiliation with EBARA CORPORATION, and his collaborations with notable colleagues such as Osamu Nabeya and Hozumi Yasuda.

Polishing Apparatus and Polishing Method:

One of Fukushima's latest patents is a sophisticated polishing apparatus and method designed to achieve precise and efficient substrate polishing. This innovative apparatus consists of several key components, including a polishing table, a rotatable head body, a retainer ring, a rotary ring, a stationary ring, and local-load exerting devices.

The polishing table serves as a platform for supporting a polishing pad with a dedicated polishing surface. The rotatable head body, with its pressing surface, interacts with the retainer ring, which presses the polishing surface while rotating with the head body. The rotary ring and stationary ring provide stability and control during the polishing process.

Fukushima's invention also incorporates local-load exerting devices, which allow for the application of specific pressure points on the stationary ring. These devices consist of a first pressing member and a second pressing member, both coupled to the stationary ring. The first pressing member is positioned upstream of the retainer ring in the polishing surface's moving direction, while the second pressing member is situated downstream.

Method and Apparatus for Polishing a Substrate:

Another notable patent by Fukushima involves a method and apparatus for achieving a flat mirror finish when polishing substrates, such as semiconductor wafers. This method employs a polishing table with a dedicated polishing surface, a top ring for holding the substrate, and a vertically movable mechanism.

During the polishing process, the top ring presses the substrate against the polishing surface. Fukushima's innovation lies in the vertical movement of the top ring, starting at a first height before pressing the substrate against the polishing surface and then transitioning to a second height afterward. This controlled vertical motion ensures optimal polishing results and a high-quality mirror-like finish.

Affiliation with EBARA CORPORATION:

Makoto Fukushima is a prominent figure within EBARA CORPORATION, a well-established company known for its advancements in industrial machinery and technology. EBARA CORPORATION, abbreviated EBARA, has been at the forefront of innovative solutions within multiple industrial sectors. Fukushima's association with EBARA highlights the company's commitment to fostering a culture of R&D and pioneering advancements within the polishing industry.

Collaborations with Osamu Nabeya and Hozumi Yasuda:

Within the circle of polishing technology, Fukushima has had the opportunity to collaborate with accomplished colleagues such as Osamu Nabeya and Hozumi Yasuda. These collaborative efforts promote knowledge exchange and encourage the development of cutting-edge techniques and advancements.

Conclusion:

Makoto Fukushima's abundant contributions to the field of polishing technology have significantly influenced and advanced the way substrates, including semiconductor wafers, are polished. His inventiveness, evident through his numerous patents, demonstrates his commitment to enhancing the efficiency and precision of polishing methods. Collaborations with esteemed colleagues further highlight Fukushima's dedication to pushing the boundaries of innovation within his field.