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For the Inventor, By the Inventor

Tokyo, Japan

Osamu Nabeya

This inventor holds 100 USPTO granted patents and 15 published patent applications and 11 EPO patents, primarily in Semiconductor Polishing (CPC class B24B37-32). Top assignee: Ebara Corporation. Active years: 2003-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Osamu Nabeya. Retrieved from https://idiyas.com/inventor/osamu-nabeya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 100 

% Patents Active = 93.0

 

Average Co-Inventor Count = 4.3

ph-index = 15

Forward Citations = 1,945(Granted Patents)

Forward Citations (Not Self Cited) = 1,722(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Kanagawa-ken, JP (2003)
  • Kanagawa, JP (2006 - 2007)
  • Chigasaki, JP (2004 - 2010)
  • Ohta-ku, JP (2009 - 2011)
  • Tokyo, JP (2003 - 2024)

Company Filing History:

goldMedal100 out of 2,583 
 
Ebara Corporation
 patents

Years Active: 2003-2025

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Areas of Expertise:
Semiconductor
Polishing Apparatus
Elastic Membrane
Substrate Holding Device
Substrate Processing
Polishing Method
Wafer Polishing
Pressure Control
Film-Thickness Measurement
Substrate Adsorption
Retainer Ring
Break-In Processing
100 patents (USPTO):Explore Patents
1. 12381089 - Information processing system, information processing method, program, and substrate processing apparatus (2025-08-05),
2. 12358096 - Rubber membrane having first and second hardness for use in a polishing head (2025-07-15),
3. 12337438 - Break-in processing apparatus and break-in processing method (2025-06-24),
4. 12230529 - Substrate holding apparatus, substrate suction determination method, substrate polishing apparatus, substrate polishing method, method of removing liquid from upper surface of wafer to be polished, elastic film for pressing wafer against polishing pad, substrate release method, and constant amount gas supply apparatus (2025-02-18),
5. 12183642 - Film-thickness measuring method, method of detecting notch portion, and polishing apparatus (2024-12-31),
6. 12128523 - Polishing apparatus (2024-10-29),
7. 12068189 - Elastic membrane, substrate holding device, and polishing apparatus (2024-08-20),
8. 11958163 - Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane (2024-04-16),
9. D1021832 - Elastic membrane (2024-04-09),
10. 11752590 - Polishing head and polishing apparatus (2023-09-12),
11. 11745306 - Polishing apparatus and method of controlling inclination of stationary ring (2023-09-05),
12. 11731235 - Polishing apparatus and polishing method (2023-08-22),
13. D989012 - Elastic membrane (2023-06-13),
14. 11654524 - Method of detecting abnormality of a roller which transmits a local load to a retainer ring, and polishing apparatus (2023-05-23),
15. D981969 - Elastic membrane for semiconductor wafer polishing apparatus (2023-03-28),

Title: Innovator Spotlight: Osamu Nabeya - Pioneering Polishing Technology

Introduction: Osamu Nabeya, a distinguished inventor based in Tokyo, Japan, has made significant contributions to the field of polishing technology. With a impressive portfolio of 94 patents, Nabeya's innovative work at Ebara Corporation has reshaped the industry landscape.

Latest Patents:

Among his latest patents is the groundbreaking 'Elastic membrane, substrate holding device, and polishing apparatus'. This invention features an elastic membrane designed for polishing heads, incorporating advanced pressure chamber technology to enhance wafer polishing processes. Nabeya's ingenuity shines through in the precision and efficiency of this novel design.

Career Highlights:

Osamu Nabeya's career at Ebara Corporation has been illustrious, marked by continuous innovation and a relentless pursuit of excellence in polishing technology. His expertise in substrate holding apparatus design has set new standards in the industry, attracting acclaim from peers and competitors alike.

Collaborations:

Throughout his career, Nabeya has collaborated closely with esteemed colleagues such as Makoto Fukushima and Hozumi Yasuda. Together, they have synergized their talents and expertise to push the boundaries of polishing technology, resulting in groundbreaking inventions that have revolutionized the industry.

Conclusion:

In conclusion, Osamu Nabeya stands as a visionary inventor whose inventive spirit and dedication to excellence have left an indelible mark on the world of polishing technology. His exceptional contributions continue to inspire and drive innovation in the industry, setting a high standard for future generations of inventors to follow.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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