The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2024

Filed:

Jun. 02, 2020
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Makoto Fukushima, Tokyo, JP;

Hozumi Yasuda, Tokyo, JP;

Keisuke Namiki, Tokyo, JP;

Osamu Nabeya, Tokyo, JP;

Shingo Togashi, Tokyo, JP;

Satoru Yamaki, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/32 (2012.01); B24B 37/005 (2012.01); B24B 49/16 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
B24B 37/32 (2013.01); B24B 37/005 (2013.01); B24B 49/16 (2013.01); H01L 21/304 (2013.01);
Abstract

A polishing apparatus polishes a substrate by bringing the substrate into sliding contact with a polishing surface. The polishing apparatus includes: a substrate holder having a substrate holding surface for pressing the substrate against the polishing surface and further having a retaining ring arranged so as to surround the substrate and brought into contact with the polishing surface, the retaining ring being configured to be tiltable independently of the substrate holding surface; a rotating mechanism configured to rotate the substrate holder about its own axis; and at least one local load exerting mechanism configured to exert a local load on a part of the retaining ring in a direction perpendicular to the polishing surface. The at least one local load exerting mechanism is arranged so as not to rotate together with the substrate holder.


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