The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2024
Filed:
Jan. 16, 2018
Ebara Corporation, Tokyo, JP;
Keisuke Namiki, Tokyo, JP;
Makoto Fukushima, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
A substrate processing apparatus includes a substrate polishing unithaving a polishing pad for polishing a wafer W, and a top ringfor holding a wafer and pressing the wafer against the polishing pad. An elastic membranefor holding a surface opposite to a polishing surface of the wafer W is attached to the top ringas a consumable. The elastic membraneis provided with a plurality of strain sensorsandfor measuring strain occurring in the elastic membraneduring polishing, and data of an amount of strain is read to a control deviceby detection unitsandThe control devicesets a processing condition such as a polishing recipe for the wafer W based on strain information of the elastic membranemeasured by the strain sensors.