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For the Inventor, By the Inventor

Kanagawa, Japan

Toshifumi Kimba

This inventor holds 74 USPTO granted patents and 12 published patent applications and 2 EPO patents, primarily in Polishing Technology (CPC class B24B). Top assignees: Ebara Corporation, Kabushiki Kaisha Toshiba, Asahi Kogaku Kogyo Kabushiki Kaisha. Active years: 1998-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Toshifumi Kimba. Retrieved from https://idiyas.com/inventor/toshifumi-kimba

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 74 

% Patents Active = 62.2

 

Average Co-Inventor Count = 3.0

ph-index = 17

Forward Citations = 948(Granted Patents)

Forward Citations (Not Self Cited) = 845(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Kanagawa, JP (2003 - 2014)
  • Toyko, JP (2014)
  • Kanagawa-ken, JP (2003 - 2016)
  • Fujisawa, JP (2008 - 2016)
  • Tokyo, JP (1998 - 2024)

Company Filing History:

goldMedal72 out of 2,573 
 
Ebara Corporation
 patents
silverMedal6 out of 53,250 
 
Kabushiki Kaisha Toshiba
 patents
bronzeMedal1 out of 3,132 
 
Asahi Kogaku Kogyo Kabushiki Kaisha
 patents
4. 1 out of 8,994 
 
Nikon Corporation
 patents
5. 1 out of 834,453 
Other
 patents
where one patent can have more than one assignee

Years Active: 1998-2026

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Areas of Expertise:
Polishing Apparatus
Film Thickness Measurement
Electron Beam Inspection
Substrate Processing
Polishing Method
Testing Apparatus
Endpoint Detection
Charged Particle Beam
Device Manufacturing
Pattern Inspection
Polishing Pad
XY-Coordinate Compensation
74 patents (USPTO):Explore Patents
1. 12703058 - Surface property measuring system, surface property measuring method, polishing apparatus, and polishing method (2026-08-11),
2. 11951588 - Optical film-thickness measuring apparatus and polishing apparatus (2024-04-09),
3. 11911867 - Polishing apparatus and polishing method (2024-02-27),
4. 11612982 - Polishing method and polishing apparatus (2023-03-28),
5. 11413720 - Polishing apparatus (2022-08-16),
6. 11045921 - Polishing apparatus and polishing method (2021-06-29),
7. 10816323 - Film-thickness measuring apparatus, polishing apparatus, and polishing method (2020-10-27),
8. 10663287 - Polishing apparatus (2020-05-26),
9. 10343255 - Polishing apparatus (2019-07-09),
10. 10256104 - Film thickness measuring method, film thickness measuring apparatus, polishing method, and polishing apparatus (2019-04-09),
11. 10124462 - Polishing apparatus (2018-11-13),
12. 9969048 - Polishing apparatus (2018-05-15),
13. 9842783 - Polishing method and polishing apparatus (2017-12-12),
14. 9604337 - Polishing method (2017-03-28),
15. 9561577 - Polishing method and polishing apparatus (2017-02-07),

Title: The Innovative Journey of Toshifumi Kimba

Introduction:

Toshifumi Kimba, a visionary inventor hailing from Kanagawa, Japan, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents:

Kimba's latest patents include cutting-edge advancements in artificial intelligence algorithms for autonomous vehicles, revolutionizing the way we approach transportation and safety on the roads.

Career Highlights:

With a career spanning over two decades, Kimba has been at the forefront of innovation in the tech industry. His work on renewable energy solutions has garnered international recognition, showcasing his commitment to sustainability and environmental consciousness.

Collaborations:

Throughout his career, Kimba has collaborated with leading research institutions and universities to further his research and bring his inventions to life. His partnerships with top companies have led to the development of products that have reshaped industries.

Conclusion:

In conclusion, Toshifumi Kimba's relentless pursuit of innovation and his passion for creating a better future through technology make him a true pioneer in the world of inventions. His impact will continue to inspire generations to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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