The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Jul. 10, 2018
Applicant:

Ebara Corporation, Tokyo, JP;

Inventor:

Toshifumi Kimba, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/06 (2006.01); B24B 37/013 (2012.01);
U.S. Cl.
CPC ...
G01B 11/0625 (2013.01); B24B 37/013 (2013.01); G01B 2210/56 (2013.01);
Abstract

A film-thickness measuring apparatus includes: a light source; an illuminating fiber coupled to the light source and having a distal end disposed at a predetermined position in a wafer supporting structure; a spectrometer configured to decompose reflected light from a wafer in accordance with wavelength and measure an intensity of the reflected light at each of wavelengths; a first light-receiving fiber having a distal end disposed at the predetermined position; a second light-receiving fiber having a distal end which is disposed at the predetermined position and is adjacent to the distal end of the first light-receiving fiber; a processor configured to determine a film thickness of the wafer based on a spectral waveform indicating a relationship between the intensity of the reflected light and the wavelength; and an optical-path selecting mechanism configured to optically connect and disconnect the second light-receiving fiber and the spectrometer.


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