The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2026

Filed:

Mar. 03, 2022
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Yosuke Nagasawa, Tokyo, JP;

Tensei Sato, Tokyo, JP;

Hideki Wakabayashi, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10P 72/00 (2026.01); H10P 72/50 (2026.01); H10P 72/76 (2026.01);
U.S. Cl.
CPC ...
H10P 72/0606 (2026.01); H10P 72/0616 (2026.01); H10P 72/53 (2026.01); H10P 72/7624 (2026.01);
Abstract

The present invention correctly identifies the size and shape of a substrate in order to avoid damage to a substrate holder and wasteful disposal of a substrate. Provided is a semiconductor manufacturing device for processing a rectangular substrate. This semiconductor manufacturing device: comprises a first sensor pair, which is used to measure a first length of the rectangular substrate along a first line and which comprises a sensor configured to detect the position of one end of the rectangular substrate on the first line and a sensor configured to detect the position of the other end of the rectangular substrate on the first line, and a second sensor pair, which is used to measure a second length of the rectangular substrate along a second line and which comprises a sensor configured to detect the position of one end of the rectangular substrate on the second line and a sensor configured to detect the position of the other end of the rectangular substrate on the second line; and identifies the size or shape of the rectangular substrate on the basis of the first length and the second length.


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Nagasawa, Yosuke. (2026). Semiconductor manufacturing apparatus (U.S. Patent No. 12796378). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12796378

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