The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2024
Filed:
Dec. 28, 2020
Ebara Corporation, Tokyo, JP;
Shao Hua Chang, Tokyo, JP;
Masaya Seki, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
Provided is a wetting method for substrate that allows reducing an amount of air bubbles attached to a surface to be plated with a simple structure. The wetting method for substrate includes a holding stepof holding a back surface of a substrate with a back plate such that a surface to be plated of the substrate is opposed to a liquid surface of a plating solution housed in a plating tank, a supplying stepof supplying the plating solution to the plating tank such that the plating solution upwardly flows through a plurality of through-holes in a center part of an ionically resistive element arranged inside the plating tank to raise a center part of the liquid surface of the plating solution, a first lowering stepof lowering a supporting member for supporting an outer edge portion of the surface to be plated of the substrate held by the holding member toward the liquid surface of the plating solution, and a second lowering stepof lowering the holding member such that the substrate is sandwiched by the supporting member lowered in the first lowering stepand the holding member while the center part of the liquid surface of the plating solution is raised in the supplying step