The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2024
Filed:
Jan. 20, 2021
Ebara Corporation, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
Provided is a technique that allows measuring a film thickness of a substrate in a plating process. A plating apparatusincludes a plating tank, a substrate holder, a rotation mechanism, a plurality of contact members, a coil, a current sensor, and a film thickness measuring device. The plurality of contact membersare disposed in a substrate holder and arranged in a circumferential direction of the substrate holder. The plurality of contact memberscontact an outer peripheral edge of a lower surface of a substrate to supply electricity to the substrate in the plating process. The coilgenerates a current by an electromagnetic induction due to a magnetic field generated by a current flowing into the contact member, the contact member being rotate together with the substrate holder in the plating process. The current sensordetects the current generated in the coil. The film thickness measuring devicemeasures a film thickness of the substrate based on the current detected by the current sensor in the plating process.