The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2024

Filed:

Mar. 17, 2021
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Masaya Seki, Tokyo, JP;

Masaki Tomita, Tokyo, JP;

Shao Hua Chang, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 21/08 (2006.01); C25D 17/00 (2006.01); C25D 17/06 (2006.01); C25D 21/10 (2006.01); C25D 21/12 (2006.01);
U.S. Cl.
CPC ...
C25D 21/08 (2013.01); C25D 17/005 (2013.01); C25D 17/06 (2013.01); C25D 21/10 (2013.01); C25D 21/12 (2013.01);
Abstract

A plating apparatusincludes a plating tank, a substrate holder, a rotation mechanism, an elevating mechanism, a contact member, and a cleaning deviceconfigured to clean the contact member. The cleaning deviceincludes a pivot shaft, a first arm, a second arm, and a nozzlethat includes at least one discharge port. Applying a cleaning fluid discharged from the discharge port to the contact membercleans the contact member


Find Patent Forward Citations

Seki, Masaya. (2024). Plating apparatus and cleaning method of contact member of plating apparatus (U.S. Patent No. 12134833). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12134833

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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