The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2022

Filed:

Jul. 16, 2019
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Masaya Seki, Tokyo, JP;

Masayuki Nakanishi, Tokyo, JP;

Makoto Kashiwagi, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 21/06 (2006.01); B24B 21/08 (2006.01); B24B 21/14 (2006.01); B24B 21/20 (2006.01); B24B 21/22 (2006.01); B24B 49/10 (2006.01); B24B 21/00 (2006.01); B24B 9/06 (2006.01); B24B 7/22 (2006.01); B24B 9/10 (2006.01); B24C 3/08 (2006.01);
U.S. Cl.
CPC ...
B24B 21/002 (2013.01); B24B 7/228 (2013.01); B24B 9/065 (2013.01); B24B 9/102 (2013.01); B24B 9/107 (2013.01); B24B 21/06 (2013.01); B24B 21/08 (2013.01); B24B 21/14 (2013.01); B24B 21/20 (2013.01); B24B 21/22 (2013.01); B24B 49/10 (2013.01); B24C 3/08 (2013.01);
Abstract

A polishing apparatus capable of forming a step-shaped recess having a right-angled cross section in an edge portion of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a substrate rotating device configured to rotate the substrate about a rotation axis; a first roller having a first circumferential surface configured to press a polishing tape against the edge portion of the substrate; and a second roller having a second circumferential surface in contact with the first circumferential surface. The second roller has a tape stopper surface that restricts movement of the polishing tape in a direction away from the rotation axis. The tape stopper surface is located radially outward of the first circumferential surface.


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