The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Dec. 09, 2020
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Masaki Tomita, Tokyo, JP;

Masaya Seki, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/06 (2006.01); C25D 7/12 (2006.01); C25D 21/12 (2006.01);
U.S. Cl.
CPC ...
C25D 17/06 (2013.01); C25D 7/12 (2013.01); C25D 21/12 (2013.01);
Abstract

A plating module includes: a plating tank, a substrate holder, and an elevating mechanism. The plating tank is for housing a plating solution. The substrate holder is for holding a substrate with a surface to be plated facing downward. The elevating mechanism is for moving up and down the substrate holder. The substrate holder includes: a supporting mechanism, a floating plate, a floating mechanism, and a pushing mechanism. The supporting mechanism is for supporting an outer peripheral portion of the surface of the substrate. The floating plate is arranged on a back surface side of the substrate. The floating mechanism is for biasing the floating plate to a direction away from a back surface of the substrate. The pushing mechanism is for pressing the floating plate to the back surface of the substrate against a biasing force to the substrate by the floating mechanism.


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