The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2024
Filed:
Dec. 22, 2020
Ebara Corporation, Tokyo, JP;
Shao Hua Chang, Tokyo, JP;
Masaya Seki, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
Provided is a technique that allows ensuring a downsized plating apparatus. A plating apparatus includes a discharge module. The discharge module includes a module main bodyincluding a plurality of nozzlesconfigured to discharge a process liquid upward, and a moving mechanismincluding a rotation shaftdisposed at a side of a plating tank and connected to the module main body. The moving mechanismmoves the module main body by rotation of the rotation shaft. The moving mechanism moves the module main body between the first position and the second position. The plurality of nozzles are arranged such that the process liquid discharged from the plurality of nozzles is brought in contact with a lower surface of a substrate from a center portion to an outer peripheral edge portion when the module main body moves to the second position. The module main body further includes a recovery member configured to recover the process liquid dropped after being discharged from the plurality of nozzles and brought in contact with the lower surface of the substrate.