The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
Dec. 01, 2021
Applicant:
Ebara Corporation, Tokyo, JP;
Inventors:
Masaki Tomita, Tokyo, JP;
Masaya Seki, Tokyo, JP;
Masashi Shimoyama, Tokyo, JP;
Shao Hua Chang, Tokyo, JP;
Assignee:
EBARA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/00 (2006.01); C25D 17/02 (2006.01); C25D 17/06 (2006.01); C25D 17/10 (2006.01);
U.S. Cl.
CPC ...
C25D 17/008 (2013.01); C25D 17/02 (2013.01); C25D 17/06 (2013.01); C25D 17/10 (2013.01);
Abstract
A plating apparatus that allows shielding a specific portion of a substrate at a desired timing is achieved. The plating apparatus includes a plating tankfor housing a plating solution, an anodearranged in the plating tank, a substrate holderfor holding a substrate Wf with a surface to be plated facing downward, a rotation mechanismfor rotating the substrate holder, and a shielding mechanismmoving a shielding memberbetween the anodeand the substrate Wf depending on a rotation angle of the substrate holder