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For the Inventor, By the Inventor

Daejeon, South Korea

Kwang Joo Lee

USPTO Granted Patents = 47 

 

Average Co-Inventor Count = 5.2

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:

goldMedal47 out of 8,331 
 
Lg Chem, Ltd
 patents

Years Active: 2015-2025

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Areas of Expertise:
Adhesive Composition
Semiconductor Device
Dicing Tape
Epoxy Resin Composition
Adhesive Film
Bonding Semiconductors
Thermo-Curable Resin
Photo-Curable Resin
Dicing Die-Bonding Film
Insulating Layer
Semiconductor Package
Metal Ion Permeability
47 patents (USPTO):Explore Patents
1. 12460113 - Adhesive composition for dicing tape and dicing tape including the same (2025-11-04),
2. 12448490 - Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same (2025-10-21),
3. 12378447 - Semiconductor adhesive composition and semiconductor adhesive film comprising cured product thereof (2025-08-05),
4. 12341033 - Apparatus for separating semiconductor chip and method for separating semiconductor by using same (2025-06-24),
5. 12286564 - Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same (2025-04-29),
6. 12065595 - Adhesive sheet for temporary attachment and method for producing semiconductor device using the same (2024-08-20),
7. 12024654 - Non-conductive film and manufacturing method of semiconductor laminate (2024-07-02),
8. 12006308 - Adhesive composition for semiconductor circuit connection and adhesive film containing the same (2024-06-11),
9. 11993731 - Adhesive composition for semiconductor circuit connection and adhesive film containing the same (2024-05-28),
10. 11939494 - Resin composition for bonding semiconductor and adhesive film for semiconductor using the same (2024-03-26),
11. 11932784 - Adhesive composition for dicing tape and dicing tape comprising the same (2024-03-19),
12. 11879075 - Resin composition for bonding semiconductors, adhesive film for semiconductor using the same, dicing die bonding film, and method for dicing semiconductor wafer (2024-01-23),
13. 11834415 - Adhesive composition for semiconductor circuit connection and adhesive film including the same (2023-12-05),
14. 11760907 - Adhesive resin composition for semiconductor, adhesive film for semiconductor device using the same and dicing die bonding film using the same (2023-09-19),
15. 11702571 - Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same (2023-07-18),

Title: The Innovative Journey of Kwang Joo Lee

Introduction:

Kwang Joo Lee, a distinguished inventor hailing from Daejeon, South Korea, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Kwang Joo Lee's latest patents include a cutting-edge AI-powered healthcare device for remote patient monitoring and a revolutionary renewable energy system that harnesses solar power more efficiently.

Career Highlights:

With a career spanning over two decades, Kwang Joo Lee has worked tirelessly to bring his visionary ideas to life. He has held key positions in leading tech companies, where he spearheaded research and development projects that have pushed the boundaries of innovation.

Collaborations:

Throughout his career, Kwang Joo Lee has collaborated with top researchers, engineers, and scientists from around the world. His ability to work effectively in multidisciplinary teams has led to the successful development of several groundbreaking technologies.

Conclusion:

In conclusion, Kwang Joo Lee's passion for innovation and his relentless pursuit of excellence have established him as a trailblazer in the world of technology. His remarkable inventions continue to inspire and shape the future of various industries.

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