The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2024
Filed:
Oct. 22, 2019
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Youngsam Kim, Daejeon, KR;
Junghak Kim, Daejeon, KR;
Ju Hyeon Kim, Daejeon, KR;
Kwang Joo Lee, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
C07D 403/12 (2006.01); C09J 7/30 (2018.01); C09J 11/06 (2006.01); C09J 163/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C07D 403/12 (2013.01); C09J 7/30 (2018.01); C09J 11/06 (2013.01); C09J 163/00 (2013.01); H01L 24/29 (2013.01);
Abstract
The present disclosure relates to a polymer compound having a specific structure, including an acrylic resin having a functional group capable of mutual hydrogen bonding with an acrylic resin having imidazole, a resin composition for bonding semiconductors including a thermoplastic resin; a thermosetting resin; a curing agent; and the polymer compound having a specific structure, and an adhesive film for semiconductor produced using the same.