The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Apr. 17, 2019
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Ju Hyeon Kim, Daejeon, KR;
Junghak Kim, Daejeon, KR;
Seunghee Nam, Daejeon, KR;
Kwang Joo Lee, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
C07D 233/58 (2006.01); C08J 5/18 (2006.01); C09J 133/08 (2006.01); C09J 163/00 (2006.01); C09J 171/12 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C07D 233/58 (2013.01); C08J 5/18 (2013.01); C09J 133/08 (2013.01); C09J 163/00 (2013.01); C09J 171/12 (2013.01); H01L 24/29 (2013.01); C08J 2333/08 (2013.01); C08J 2363/00 (2013.01); C08J 2371/12 (2013.01); C08J 2433/08 (2013.01); C08J 2463/00 (2013.01); C08J 2471/12 (2013.01); H01L 2224/2919 (2013.01); H01L 2924/066 (2013.01); H01L 2924/0665 (2013.01);
Abstract
The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.