The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
Oct. 20, 2020
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Eun Bum Kim, Daejeon, KR;
Kwang Joo Lee, Daejeon, KR;
Jung Hak Kim, Daejeon, KR;
Ju Hyeon Kim, Daejeon, KR;
Yoon Sun Jang, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
C09J 133/10 (2006.01); C09J 11/04 (2006.01); C09J 11/08 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C09J 133/10 (2013.01); C09J 11/04 (2013.01); C09J 11/08 (2013.01); C09J 163/00 (2013.01); C09J 2203/326 (2013.01); C09J 2301/304 (2020.08); C09J 2301/312 (2020.08); C09J 2301/408 (2020.08); C09J 2301/414 (2020.08);
Abstract
The present invention relates to an adhesive composition for a semiconductor and an adhesive film for a semiconductor including a cured product thereof, and in particular, to an adhesive composition for a semiconductor capable of removing voids occurring between an adherend and an adhesive and reducing bleed-out, and an adhesive film for a semiconductor including a cured product thereof.