The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
May. 08, 2020
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Youngsam Kim, Daejeon, KR;
You Jin Kyung, Daejeon, KR;
Kwang Joo Lee, Daejeon, KR;
Minsu Jeong, Daejeon, KR;
Junghak Kim, Daejeon, KR;
Ju Hyeon Kim, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/04 (2005.12); C09J 7/10 (2017.12); C09J 11/04 (2005.12); C09J 11/08 (2005.12); H01L 23/00 (2005.12);
U.S. Cl.
CPC ...
C09J 163/04 (2012.12); C09J 7/10 (2017.12); C09J 11/04 (2012.12); C09J 11/08 (2012.12); H01L 24/29 (2012.12); H01L 24/83 (2012.12); C09J 2433/00 (2012.12); C09J 2463/00 (2012.12); H01L 2224/2919 (2012.12); H01L 2224/83203 (2012.12);
Abstract
The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.