The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Jun. 05, 2020
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Junghak Kim, Daejeon, KR;
You Jin Kyung, Daejeon, KR;
Kwang Joo Lee, Daejeon, KR;
Minsu Jeong, Daejeon, KR;
Ju Hyeon Kim, Daejeon, KR;
Youngsam Kim, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C08G 59/30 (2006.01); C08G 59/32 (2006.01); C08G 77/14 (2006.01); C08L 33/20 (2006.01); C08L 63/00 (2006.01); C08L 83/06 (2006.01); C09J 7/00 (2018.01); C09J 7/10 (2018.01); C09J 7/30 (2018.01); C09J 11/00 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09J 133/20 (2006.01); C09J 183/06 (2006.01); C09J 183/12 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 183/06 (2013.01); C09J 2203/326 (2013.01);
Abstract
The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.