The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2024
Filed:
Aug. 17, 2021
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Jong Min Jang, Daejeon, KR;
Byoung Ju Choi, Daejeon, KR;
Kwang Joo Lee, Daejeon, KR;
Yu Lin Sun, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C09J 133/08 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C09J 133/08 (2013.01);
Abstract
A technical problem to be achieved by the present disclosure is to provide an adhesive resin composition for a conductor, which contains inorganic fillers having different average particle diameters and has enhanced thermal conductivity as a result of controlling the content of the inorganic fillers, and an adhesive film for a semiconductor produced using the same.
Jang, Jong. (2024). Resin composition for bonding semiconductor and adhesive film for semiconductor using the same (U.S. Patent No. 11939494). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11939494
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile