The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Jun. 12, 2020
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Eun Yeong Kim, Daejeon, KR;
You Jin Kyung, Daejeon, KR;
Kwang Joo Lee, Daejeon, KR;
Ji Ho Han, Daejeon, KR;
Bora Yeon, Daejeon, KR;
Mi Jang, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C09J 7/24 (2018.01); H01L 23/00 (2006.01); C08K 5/29 (2006.01); C09J 7/40 (2018.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C09J 7/245 (2018.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); C08K 5/29 (2013.01); C09J 7/40 (2018.01); C09J 2433/00 (2013.01); H01L 2224/29025 (2013.01); H01L 2224/2919 (2013.01); H01L 2924/0665 (2013.01);
Abstract
The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.