The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 24, 2025

Filed:

Feb. 04, 2021
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Eun Bum Kim, Daejeon, KR;

Ju Hyeon Kim, Daejeon, KR;

Kwang Joo Lee, Daejeon, KR;

Jung Hak Kim, Daejeon, KR;

Yoon Sun Jang, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); C09J 7/10 (2018.01); C09J 11/00 (2006.01); H01F 1/44 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); C09J 7/10 (2018.01); C09J 11/00 (2013.01); H01F 1/44 (2013.01); H01L 21/6836 (2013.01); H01L 21/6838 (2013.01); C09J 2203/326 (2013.01); C09J 2301/408 (2020.08); C09J 2301/502 (2020.08);
Abstract

Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a push member on a side of the base member opposite to a side on which the semiconductor chip is disposed and moving the push member in a direction towards the semiconductor chip; and a step of separating the semiconductor chip, moved together with the push member, from the base member through a pick-up unit. The adhesive member and the push member are each magnetized such that repulsive forces act on each other.


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