The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2024
Filed:
Nov. 01, 2019
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Wanjung Kim, Daejeon, KR;
Jong Min Jang, Daejeon, KR;
Byung Ju Choi, Daejeon, KR;
Kwang Joo Lee, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
C09J 133/08 (2006.01); C08K 3/22 (2006.01); C08K 5/5419 (2006.01); C08K 9/06 (2006.01); C09J 163/04 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
C09J 133/08 (2013.01); C08K 3/22 (2013.01); C08K 5/5419 (2013.01); C08K 9/06 (2013.01); C09J 163/04 (2013.01); H01L 21/683 (2013.01); H01L 21/78 (2013.01); C08K 2003/2227 (2013.01);
Abstract
The present invention relates to a resin composition for bonding semiconductors including two types of curing catalyst mixtures together with a heat dissipation filler in which a specific functional group is introduced onto the surface, an adhesive film for semiconductor produced therefrom, a dicing die bonding film and a method for dicing a semiconductor wafer.