The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2023
Filed:
Aug. 17, 2021
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
C09J 133/04 (2006.01); C09J 11/04 (2006.01); C09J 7/20 (2018.01); C08K 5/13 (2006.01); C09J 163/00 (2006.01); C09J 133/06 (2006.01); H01L 21/683 (2006.01); C08K 5/00 (2006.01); C08K 3/04 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
C09J 133/068 (2013.01); C08K 3/042 (2017.05); C08K 5/0025 (2013.01); C08K 5/13 (2013.01); C09J 7/20 (2018.01); C09J 11/04 (2013.01); C09J 163/00 (2013.01); H01L 21/6836 (2013.01); C08K 2003/222 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2231 (2013.01); C08K 2003/2262 (2013.01); C08K 2003/2265 (2013.01); C08K 2201/01 (2013.01); C09J 2203/326 (2013.01); C09J 2301/122 (2020.08); C09J 2301/208 (2020.08); C09J 2301/408 (2020.08); C09J 2400/10 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); H01L 2221/68327 (2013.01);
Abstract
The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.