The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Apr. 16, 2021
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Seung Hee Nam, Daejeon, KR;
Kwang Joo Lee, Daejeon, KR;
Jung Hak Kim, Daejeon, KR;
Eun Byurl Cho, Daejeon, KR;
Young Sam Kim, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
C08G 61/02 (2006.01); C08K 3/36 (2006.01); C08K 5/07 (2006.01); C08K 5/3445 (2006.01); C09J 11/08 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C08G 61/02 (2013.01); C08K 3/36 (2013.01); C08K 5/07 (2013.01); C08K 5/3445 (2013.01); C09J 11/08 (2013.01); C09J 163/00 (2013.01); C08G 2170/00 (2013.01); C08K 2201/003 (2013.01); C09J 2203/326 (2013.01); C09J 2301/408 (2020.08); C09J 2463/00 (2013.01);
Abstract
The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.