The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Apr. 11, 2019
Adhesive sheet for temporary attachment and method for producing semiconductor device using the same
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/32 (2018.01); C09J 7/24 (2018.01); C09J 7/25 (2018.01); C09J 7/40 (2018.01); C09J 133/14 (2006.01); H01L 21/683 (2006.01); C08K 5/29 (2006.01); C08K 5/5397 (2006.01);
U.S. Cl.
CPC ...
C09J 7/243 (2018.01); C09J 7/255 (2018.01); C09J 7/40 (2018.01); C09J 133/14 (2013.01); H01L 21/6836 (2013.01); C08K 5/29 (2013.01); C08K 5/5397 (2013.01); C09J 2301/208 (2020.08); C09J 2301/408 (2020.08); C09J 2301/416 (2020.08); H01L 2221/68327 (2013.01); H01L 2221/68386 (2013.01); Y10T 428/14 (2015.01); Y10T 428/1476 (2015.01); Y10T 428/2809 (2015.01); Y10T 428/2848 (2015.01); Y10T 428/2891 (2015.01);
Abstract
The present disclosure relates to an adhesive sheet for temporary attachment which is excellent in heat resistance and can realize sufficient adhesive strength even when being subjected to a high temperature process during the semiconductor production process, and can exhibit a sufficient reduction in adhesive strength due to photocuring in a peeling step, and a method for producing a semiconductor device using the same.