Lg Chem, Ltd

Kwang Joo Lee

Jung Hak Kim

Hee Jung Kim

Se Ra Kim

Young Kook Kim

Seung Hee Nam

You Jin Kyung

Jung Ho Jo

Byung Ju Choi

Ji Ho Han

Woo Jae Jeong

Sera Kim

Minsu Jeong

Ju Hyeon Kim

Bo Yun Choi

Min Su Jeong

Eun Yeong Kim

Junghak Kim

Jong Min Jang

Mi Jang

Youngsam Kim

Eunbyurl Cho

Mun Seop Song

Bora Yeon

Seung Heon Lee

Ji Young Hwang

Se Jin Ku

Sang Hwan Kim

Jooyeon Kim

Chang Yoon Lim

Ji Eun Myung

Byung-Ju Choi

Woo-Jae Jeong

Bo-Yun Choi

Min-Su Jeong

Yu Lin Sun

Yoon Sun Jang

Eun Bum Kim

Da Ae Kim

Se-Jin Ku

Mi Seon Yoon

Sung Chan Park

Kwang Su Seo

Seunghee Nam

Mi Jin Jang

Yeong Im Yu

Nu Ri Na

Wanjung Kim

Byoung Ju Choi

Heejung Kim

The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a reducing agent, and a photoinitiator.

Adhesive composition for dicing tape and dicing tape including the same

The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.

Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same

The present invention relates to an adhesive composition for a semiconductor and an adhesive film for a semiconductor including a cured product thereof, and in particular, to an adhesive composition for a semiconductor capable of removing voids occurring between an adherend and an adhesive and reducing bleed-out, and an adhesive film for a semiconductor including a cured product thereof.

Semiconductor adhesive composition and semiconductor adhesive film comprising cured product thereof

Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a push member on a side of the base member opposite to a side on which the semiconductor chip is disposed and moving the push member in a direction towards the semiconductor chip; and a step of separating the semiconductor chip, moved together with the push member, from the base member through a pick-up unit. The adhesive member and the push member are each magnetized such that repulsive forces act on each other.

Apparatus for separating semiconductor chip and method for separating semiconductor by using same

The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.

Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same

The present disclosure relates to an adhesive sheet for temporary attachment which is excellent in heat resistance and can realize sufficient adhesive strength even when being subjected to a high temperature process during the semiconductor production process, and can exhibit a sufficient reduction in adhesive strength due to photocuring in a peeling step, and a method for producing a semiconductor device using the same.

Adhesive sheet for temporary attachment and method for producing semiconductor device using the same

The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.

Non-conductive film and manufacturing method of semiconductor laminate

The present disclosure relates to a polymer compound having a specific structure, including an acrylic resin having a functional group capable of mutual hydrogen bonding with an acrylic resin having imidazole, a resin composition for bonding semiconductors including a thermoplastic resin; a thermosetting resin; a curing agent; and the polymer compound having a specific structure, and an adhesive film for semiconductor produced using the same.

Adhesive composition for semiconductor circuit connection and adhesive film containing the same

The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.

A technical problem to be achieved by the present disclosure is to provide an adhesive resin composition for a conductor, which contains inorganic fillers having different average particle diameters and has enhanced thermal conductivity as a result of controlling the content of the inorganic fillers, and an adhesive film for a semiconductor produced using the same.

Resin composition for bonding semiconductor and adhesive film for semiconductor using the same

The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.

Adhesive composition for dicing tape and dicing tape comprising the same

The present invention relates to a resin composition for bonding semiconductors including two types of curing catalyst mixtures together with a heat dissipation filler in which a specific functional group is introduced onto the surface, an adhesive film for semiconductor produced therefrom, a dicing die bonding film and a method for dicing a semiconductor wafer.

Resin composition for bonding semiconductors, adhesive film for semiconductor using the same, dicing die bonding film, and method for dicing semiconductor wafer

The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.

Adhesive composition for semiconductor circuit connection and adhesive film including the same

The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.

Adhesive resin composition for semiconductor, adhesive film for semiconductor device using the same and dicing die bonding film using the same

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same

Growing community of inventors

Daejeon, South Korea

Kwang Joo Lee