Huiming Bu

This inventor holds 99 USPTO granted patents and 15 published patent applications and 1 EPO patent, primarily in Vertical Transistors (CPC class H01L29-66795). Top assignees: International Business Machines Corporation, Globalfoundries Inc., Adeia Semiconductor Bonding Technologies Inc.. Active years: 2010-2026.

USPTO Granted Patents = 99 (Patent Applications = 15)

% Patents Active = 62.6

EPO Patents = 1 (Patent Applications = 3)

Average Co-Inventor Count = 4.6

ph-index = 13

Forward Citations = 903(Granted Patents)

Forward Citations (Not Self Cited) = 849(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Ossining, NY (US) (2010 - 2011)
Milwood, NY (US) (2014)
Albany, NY (US) (2012 - 2015)
Millwood, NY (US) (2011 - 2021)
Glenmont, NY (US) (2011 - 2024)

Company Filing History:

94 out of 166,209

International Business Machines Corporation

Adeia Semiconductor Bonding Technologies Inc.

patents

4. 2 out of 2,043

The State University of New York

patents

5. 1 out of 30

Adeia Semiconductor Solutions LLC

patents

6. 1 out of 2,891

Stmicroelectronics Gmbh

patents

where one patent can have more than one assignee

Years Active: 2010-2026

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Areas of Expertise:

Vertical Transistor

Electrostatic Discharge

Fin Field-Effect Transistor

Nanosheet Structures

Sacrificial Liner

Junction Field Effect

Device Structures

Power Distribution

Density Scaling

Conformal Doping

Local Layout Effects

Silicidation

99 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12690443 - Self-aligned backside contact with increased contact area (2026-07-21),

2. 12685153 - Sensor for thermal dissipation measurement (2026-07-14),

3. 12677651 - Self-aligned buried power rail formation for semiconductor devices (2026-07-07),

4. 12666648 - Enabling anneal for reliability improvement and multi-VT with interfacial layer regrowth suppression (2026-06-23),

5. 12593468 - Self-aligned backside contact with increased contact area (2026-03-31),

6. 12550359 - Forming a sacrificial liner for dual channel devices (2026-02-10),

7. 12422465 - In-situ chip design for pulse IV self-heating evaluation (2025-09-23),

8. 12268031 - Backside power rails and power distribution network for density scaling (2025-04-01),

9. 12166042 - Stacked nanosheet gate-all-around device structures (2024-12-10),

10. 11894462 - Forming a sacrificial liner for dual channel devices (2024-02-06),

11. 11329136 - Enabling anneal for reliability improvement and multi-Vt with interfacial layer regrowth suppression (2022-05-10),

12. 11189729 - Forming a sacrificial liner for dual channel devices (2021-11-30),

13. 11139385 - Interface-less contacts to source/drain regions and gate electrode over active portion of device (2021-10-05),

14. 11094824 - Forming a sacrificial liner for dual channel devices (2021-08-17),

15. 11088278 - Precise junction placement in vertical semiconductor devices using etch stop layers (2021-08-10),

Title: The Innovative Journey of Inventor Huiming Bu

Introduction: Huiming Bu, a talented inventor based in Glenmont, NY (US), has made significant contributions to the field of technology with his creative and groundbreaking ideas.

Latest Patents: Huiming Bu holds several patents in various technological areas, including artificial intelligence, renewable energy, and medical devices. His most recent patent focuses on a revolutionary method for enhancing solar panel efficiency through advanced nanotechnology.

Career Highlights: With a background in engineering and a passion for innovation, Huiming Bu has successfully led research and development teams in creating cutting-edge solutions for complex challenges. His expertise in renewable energy technologies has led to the development of sustainable solutions that are shaping the future of clean energy.

Collaborations: Throughout his career, Huiming Bu has collaborated with leading research institutions, universities, and technology companies to bring his inventions to life. His collaborative spirit and dedication to excellence have resulted in successful partnerships that have propelled his innovations to new heights.

Conclusion: Huiming Bu's relentless pursuit of innovation and his commitment to pushing the boundaries of technology have established him as a visionary inventor in the field. His groundbreaking inventions continue to inspire and pave the way for a more sustainable and technologically advanced future.