The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Mar. 22, 2024
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Huimei Zhou, Albany, NY (US);

Oleg Gluschenkov, Tannersville, NY (US);

Ruilong Xie, Niskayuna, NY (US);

Xiaoming Yang, Clifton Park, NY (US);

Jingyu Lian, Hopewell Junction, NY (US);

Miaomiao Wang, Albany, NY (US);

Haojun Zhang, Schenectady, NY (US);

Huiming Bu, Glenmont, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 40/00 (2026.01); G01K 17/00 (2006.01); H10D 30/43 (2025.01); H10D 30/67 (2025.01); H10W 20/41 (2026.01);
U.S. Cl.
CPC ...
H10W 40/00 (2026.01); G01K 17/00 (2013.01); H10D 30/43 (2025.01); H10D 30/6729 (2025.01); H10W 20/427 (2026.01);
Abstract

A structure is provided that includes a thermal dissipation measurement sensor located on the frontside or the backside of a semiconductor device. The thermal dissipation measurement sensor includes a first probe region and a second probe region that are interconnected by a plurality of metal lines that are arranged in a serpentine pattern and having at least one non-powered metal line located between, and spaced apart from, each of the metal lines.


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