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For the Inventor, By the Inventor

Hsinchu, Taiwan

Hua-Shu Ivan Wu

This inventor holds 30 USPTO granted patents, primarily in MEMS Technology. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Miradia Inc., United Microelectronics Corp.. Active years: 2000-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hua-Shu Ivan Wu. Retrieved from https://idiyas.com/inventor/hua-shu-ivan-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30

% Patents Active = 40.0

Average Co-Inventor Count = 3.1

ph-index = 5

Forward Citations = 87(Granted Patents)


Location History:

  • Hsinchu, TW (2000 - 2018)
  • Hsinchu County, TW (2020 - 2021)

Company Filing History:

goldMedal25 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal2 out of 90 
 
Miradia Inc.
 patents
bronzeMedal2 out of 7,278 
 
United Microelectronics Corp.
 patents
4. 1 out of 12 
 
Miramems Sensing Technology Co., Ltd
 patents

Years Active: 2000-2021

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Areas of Expertise:
MEMS Device
Semiconductor Fabrication
Micromechanical Structure
Wafer Bonding
Overlay Measurement
CMOS-MEMS Integration
Micro-Lens Fabrication
Probe Card Structure
Electrical Conducting Paths
Patterning Lines
Inkjet Printhead
Micro Optical Mirrors
30 patents (USPTO):Explore Patents
1. 10961118 - Wafer level integrated MEMS device enabled by silicon pillar and smart cap (2021-03-30),
2. 10899608 - Wafer level integrated MEMS device enabled by silicon pillar and smart cap (2021-01-26),
3. 10556792 - Wafer level integrated MEMS device enabled by silicon pillar and smart cap (2020-02-11),
4. 10040681 - Method and system for MEMS devices (2018-08-07),
5. 9278853 - Manufacturing process of MEMS device (2016-03-08),
6. 8754529 - MEMS device with simplified electrical conducting paths (2014-06-17),
7. 8278724 - Methods of fabricating a micromechanical structure (2012-10-02),
8. 8119992 - System for overlay measurement in semiconductor manufacturing (2012-02-21),
9. 8084361 - Semiconductor fabrication method suitable for MEMS (2011-12-27),
10. 8049323 - Chip holder with wafer level redistribution layer (2011-11-01),
11. 8012785 - Method of fabricating an integrated CMOS-MEMS device (2011-09-06),
12. 7851331 - Bonding structures and methods of forming bonding structures (2010-12-14),
13. 7732299 - Process for wafer bonding (2010-06-08),
14. 7728396 - Semiconductor structures (2010-06-01),
15. 7696766 - Ultra-fine pitch probe card structure (2010-04-13),

Title: The Innovative Journey of Inventor Hua-Shu Ivan Wu

Introduction: Hua-Shu Ivan Wu, a distinguished inventor hailing from Hsinchu County, Taiwan, has made significant contributions to the field of technology and innovation.

Latest Patents: Hua-Shu Ivan Wu holds several groundbreaking patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his versatility and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Hua-Shu Ivan Wu has worked with leading tech companies and research institutions, playing a pivotal role in developing cutting-edge solutions that have revolutionized the industry.

Collaborations: Throughout his career, Hua-Shu Ivan Wu has collaborated with top engineers, scientists, and researchers from around the globe, fostering a culture of innovation and knowledge exchange that has led to remarkable advancements in various fields.

Conclusion: Hua-Shu Ivan Wu's passion for innovation, coupled with his relentless pursuit of excellence, has established him as a visionary inventor whose work continues to inspire and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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