The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2016

Filed:

Apr. 18, 2014
Applicant:

Miradia, Inc., Santa Clara, CA (US);

Inventors:

Yu-Hao Chien, Taipei, TW;

Hua-Shu Wu, Hsinchu, TW;

Shih-Yung Chung, Hsinchu County, TW;

Li-Tien Tseng, Taoyuang County, TW;

Yu-Te Yeh, Taichung County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00238 (2013.01); B81C 1/0023 (2013.01); B81C 2203/0792 (2013.01);
Abstract

A manufacturing process of a MEMS device divides a substrate for fabricating a MEMS component into two electrically isolated regions, so that the MEMS component and the circuit disposed on its surface could connect electrically with another substrate below respectively through the corresponding conducing regions, whereby the configuration of the electrical conducting paths and the manufacturing process are simplified. A MEMS device manufactured by using the aforementioned process is also disclosed herein.


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