The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2011
Filed:
May. 30, 2007
Tsung-cheng Huang, Jhubei, TW;
Hua-shu Wu, Hsinchu, TW;
Fa-yuan Chang, Taipei, TW;
I-ching Lin, Taipei, TW;
Hsi-lung Lee, Jhudong Township, TW;
Yuan-hao Chien, Taipei, TW;
Tsung-Cheng Huang, Jhubei, TW;
Hua-Shu Wu, Hsinchu, TW;
Fa-Yuan Chang, Taipei, TW;
I-Ching Lin, Taipei, TW;
Hsi-Lung Lee, Jhudong Township, TW;
Yuan-Hao Chien, Taipei, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A method includes depositing a layer of a sacrificial material in a first region above a substrate. The first region of the substrate is separate from a second region of the substrate, where a corrosion resistant film is to be provided above the second region. The corrosion resistant film is deposited, so that a first portion of the corrosion resistant film is above the sacrificial material in the first region, and a second portion of the corrosion resistant film is above the second region. The first portion of the corrosion resistant film is removed by chemical mechanical polishing. The sacrificial material is removed from the first region using an etching process that selectively etches the sacrificial material, but not the corrosion resistant film.