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Taipei, Taiwan

Fa-Yuan Chang

This inventor holds 5 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2000-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fa-Yuan Chang. Retrieved from https://idiyas.com/inventor/fa-yuan-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 5

% Patents Active = 40.0

Average Co-Inventor Count = 4.3

ph-index = 3

Forward Citations = 32(Granted Patents)


Company Filing History:

goldMedal5 out of 43,653 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2000-2011

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5 patents (USPTO):Explore Patents
1. 8084361 - Semiconductor fabrication method suitable for MEMS (2011-12-27),
2. 7732299 - Process for wafer bonding (2010-06-08),
3. 7696766 - Ultra-fine pitch probe card structure (2010-04-13),
4. 6679064 - Wafer transfer system with temperature control apparatus (2004-01-20),
5. 6069091 - In-situ sequential silicon containing hard mask layer/silicon layer (2000-05-30),

Title: Fa-Yuan Chang: Innovator in Semiconductor Technology

Introduction

Fa-Yuan Chang is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative methods that enhance the fabrication and bonding processes in microelectronic devices.

Latest Patents

One of his latest patents is a semiconductor fabrication method suitable for MEMS. This method involves depositing a layer of sacrificial material in a designated region above a substrate, which is separate from another region where a corrosion-resistant film is applied. The process includes removing the first portion of the corrosion-resistant film through chemical mechanical polishing and etching the sacrificial material selectively.

Another notable patent is a process for wafer bonding, which outlines a method for manufacturing microelectronic devices. This method includes forming a top metal layer on a substrate, applying a dielectric layer, and performing a chemical mechanical polishing process before bonding the first substrate to a second substrate. These innovations are crucial for advancing microelectronic device manufacturing.

Career Highlights

Fa-Yuan Chang is currently employed at Taiwan Semiconductor Manufacturing Company Ltd. His expertise in semiconductor fabrication has positioned him as a key player in the industry. His patents reflect his commitment to improving manufacturing processes and enhancing device performance.

Collaborations

Throughout his career, Fa-Yuan has collaborated with notable colleagues, including Hua-Shu Ivan Wu and Ming-Yeon Hung. These collaborations have contributed to the development of cutting-edge technologies in the semiconductor field.

Conclusion

Fa-Yuan Chang's contributions to semiconductor technology through his innovative patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence the future of microelectronic device manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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