The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Apr. 24, 2009
Kai-chih Liang, Zhubei, TW;
Hua-shu Wu, Hsinchu, TW;
Li-chun Peng, Hsin-Chu, TW;
Tsung-cheng Huang, Jhubei, TW;
Mingo Liu, Hsinchu, TW;
Nick Y. M. Shen, Chu-Pei, TW;
Allen Timothy Chang, Taipei, TW;
Kai-Chih Liang, Zhubei, TW;
Hua-Shu Wu, Hsinchu, TW;
Li-Chun Peng, Hsin-Chu, TW;
Tsung-Cheng Huang, Jhubei, TW;
Mingo Liu, Hsinchu, TW;
Nick Y. M. Shen, Chu-Pei, TW;
Allen Timothy Chang, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
An embodiment of a method is provided that includes providing a substrate having a frontside and a backside. A CMOS device is formed on the substrate. A MEMS device is also formed on the substrate. Forming the MEMS device includes forming a MEMS mechanical structure on the frontside of the substrate. The MEMS mechanical structure is then released. A protective layer is formed on the frontside of the substrate. The protective layer is disposed on the released MEMS mechanical structure (e.g., protects the MEMS structure). The backside of the substrate is processed while the protective layer is disposed on the MEMS mechanical structure.