Company Filing History:
Years Active: 2011-2025
Title: **Li-Chun Peng: An Innovator in Semiconductor Technology**
Introduction
Li-Chun Peng, based in Hsin-Chu, Taiwan, is a distinguished inventor in the field of semiconductor technology. With a portfolio that consists of three patents, Peng has made significant contributions to the advancement of bonding structures and microelectromechanical systems.
Latest Patents
Li-Chun Peng's latest innovations include two notable patents. The first patent, titled "Bonding structure and method thereof," presents a sophisticated bonding method and structure. This innovation involves a device substrate that comprises multiple semiconductor devices, each featuring a first bonding layer. Complementarily, a cap substrate containing cap structures with a second bonding layer is described, where the second bonding layer consists of a planar surface with a protrusion. This design facilitates an effective bonding process between the device substrate and the cap substrate, enhancing the overall stability of semiconductor devices.
The second patent focuses on the "Semiconductor device having microelectromechanical systems devices with improved cavity pressure uniformity." This patent outlines a semiconductor device containing an interconnect structure over a semiconductor substrate, with a dielectric structure on top. The invention emphasizes a plurality of cavities within this dielectric structure and introduces a microelectromechanical system (MEMS) substrate featuring movable membranes. These membranes are designed to improve fluid communication between cavities, which is essential for the enhanced performance of MEMS devices.
Career Highlights
Li-Chun Peng is employed at Taiwan Semiconductor Manufacturing Company Limited, a renowned leader in semiconductor manufacturing. His innovative work not only showcases his technical expertise but also reflects the company's commitment to pushing the boundaries of technology in the semiconductor industry.
Collaborations
In his professional journey, Peng has had the opportunity to collaborate with talented colleagues, including Kai-Chih Liang and Hua-Shu Ivan Wu. These collaborations have been instrumental in fostering a creative environment that enables groundbreaking advancements in their respective fields.
Conclusion
Li-Chun Peng’s contributions to semiconductor technology exemplify the spirit of innovation that drives progress in the industry. With a focus on bonding structures and microelectromechanical systems, his work not only enhances device performance but also sets a precedent for future inventors and researchers in semiconductor advancements.