The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2011
Filed:
Feb. 16, 2007
Chen-shien Chen, Hsinchu, TW;
Chao-hsiang Yang, Hsinchu, TW;
Jimmy Liang, Chung-Li, TW;
Han-liang Tseng, Hsinchu, TW;
Mirng-ji Lii, Sinpu Township, Hsinchu County, TW;
Tjandra Winata Karta, Hsinchu, TW;
Hua-shu Wu, Hsinchu, TW;
Chen-Shien Chen, Hsinchu, TW;
Chao-Hsiang Yang, Hsinchu, TW;
Jimmy Liang, Chung-Li, TW;
Han-Liang Tseng, Hsinchu, TW;
Mirng-Ji Lii, Sinpu Township, Hsinchu County, TW;
Tjandra Winata Karta, Hsinchu, TW;
Hua-Shu Wu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A chip holder formed of silicon, glass, other ceramics or other suitable materials includes a plurality of recesses for retaining semiconductor chips. The bond pads of the semiconductor chip are formed on or over an area of the chip holder that surrounds the semiconductor chip thus expanding the bonding area. The bond pads are coupled, using semiconductor wafer processing techniques, to internal bond pads formed directly on the semiconductor chip.