Chao-Hsiang Yang

This inventor holds 23 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2003-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chao-Hsiang Yang. Retrieved from https://idiyas.com/inventor/chao-hsiang-yang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23

% Patents Active = 78.3

Average Co-Inventor Count = 3.6

ph-index = 10

Forward Citations = 1,923(Granted Patents)

Company Filing History:

23 out of 42,926

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2003-2025

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Areas of Expertise:

Integrated Circuit

Semiconductor Structure

Microbumps

Chip Testing

Wafer Level Redistribution

Die Seal Structure

Laser Fuse

Protective Metal Structure

Metal Fuse

Flip-Chip Devices

Manufacturing Method

23 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12469753 - Integrated circuit component and package structure having the same (2025-11-11),

2. 12322742 - Semiconductor structure and manufacturing method thereof (2025-06-03),

3. 11869819 - Integrated circuit component and package structure having the same (2024-01-09),

4. 11855066 - Semiconductor structure and manufacturing method thereof (2023-12-26),

5. 11450579 - Integrated circuit component and package structure having the same (2022-09-20),

6. 11335672 - Semiconductor structure and manufacturing method thereof (2022-05-17),

7. 11169207 - Testing of semiconductor chips with microbumps (2021-11-09),

8. 10957610 - Integrated circuit component and package structure having the same (2021-03-23),

9. 10741537 - Semiconductor structure and manufacturing method thereof (2020-08-11),

10. 10663512 - Testing of semiconductor chips with microbumps (2020-05-26),

11. 10483174 - Integrated circuit component and package structure having the same (2019-11-19),

12. 10175294 - Testing of semiconductor chips with microbumps (2019-01-08),

13. 9618572 - Testing of semiconductor chips with microbumps (2017-04-11),

14. 9372206 - Testing of semiconductor chips with microbumps (2016-06-21),

15. 9116203 - Testing of semiconductor chips with microbumps (2015-08-25),

Title: The Innovative Journey of Chao-Hsiang Yang

Introduction:

Chao-Hsiang Yang, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Chao-Hsiang Yang's latest patents include cutting-edge advancements in semiconductor technology, renewable energy solutions, and artificial intelligence systems, showcasing his versatility and forward-thinking approach.

Career Highlights:

With a career spanning over two decades, Chao-Hsiang Yang has held key positions in leading tech companies, where he spearheaded research and development projects that have resulted in numerous successful patents and inventions. His expertise in areas such as nanotechnology and microelectronics has earned him recognition as a pioneer in his field.

Collaborations:

Throughout his career, Chao-Hsiang Yang has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing. His collaborative efforts have led to the development of cutting-edge technologies that have revolutionized various industries.

Conclusion:

In conclusion, Chao-Hsiang Yang's passion for innovation, coupled with his technical expertise and collaborative spirit, continues to drive him towards creating solutions that have a lasting impact on society. His relentless pursuit of excellence cements his position as a visionary inventor shaping the future of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]