The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2020
Filed:
Dec. 26, 2018
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Wei-Cheng Wu, Hsinchu, TW;
Hsien-Pin Hu, Zhubei, TW;
Shang-Yun Hou, Jubei, TW;
Shin-Puu Jeng, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Chao-Hsiang Yang, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); G01R 1/04 (2006.01); G01R 31/26 (2020.01);
U.S. Cl.
CPC ...
G01R 31/2896 (2013.01); G01R 1/0416 (2013.01); G01R 31/2601 (2013.01); G01R 31/2884 (2013.01); G01R 31/2886 (2013.01); G01R 31/2889 (2013.01); G01R 31/2893 (2013.01); H01L 22/32 (2013.01); H01L 24/06 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/0392 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05027 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/0614 (2013.01); H01L 2224/0616 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/16238 (2013.01);
Abstract
A device includes a test pad on a chip. A first microbump has a first surface area that is less than a surface area of the test pad. A first conductive path couples the test pad to the first microbump. A second microbump has a second surface area that is less than the surface area of the test pad. A second conductive path couples the test pad to the second microbump.