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For the Inventor, By the Inventor

Zhubei, Taiwan

Hsien-Pin Hu

USPTO Granted Patents = 83 

Average Co-Inventor Count = 5.7

ph-index = 12

Forward Citations = 3,198(Granted Patents)

Forward Citations (Not Self Cited) = 3,104(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hsinchu, TW (2006)
  • Hsinchu County, TW (2022)
  • Zhubei, TW (2012 - 2024)

Company Filing History:

goldMedal83 out of 40,850 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2006-2025

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Areas of Expertise:
Integrated Circuit Package
Semiconductor Devices
Chiplet Interposer
3D IC Architecture
Through Silicon Vias
Heat Dissipation Structure
Giga Interposer Integration
Testing Semiconductor Chips
Stacked Integrated Circuit Structure
Microbumps
Configurable Routing
Dummy Die Formation
83 patents (USPTO):Explore Patents
1. 12294002 - Integrated circuit package and method of forming same (2025-05-06),
2. 12266612 - Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features (2025-04-01),
3. 12243824 - Semiconductor devices and methods of manufacture (2025-03-04),
4. 12148719 - Forming large chips through stitching (2024-11-19),
5. 12094836 - Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof (2024-09-17),
6. 12021006 - Package structure and method and equipment for forming the same (2024-06-25),
7. 12015023 - Integrated circuit package and method of forming same (2024-06-18),
8. 11996371 - Chiplet interposer (2024-05-28),
9. 11967546 - Giga interposer integration through Chip-On-Wafer-On-Substrate (2024-04-23),
10. 11923310 - Package structure including through via structures (2024-03-05),
11. 11854990 - Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die (2023-12-26),
12. 11854983 - Semiconductor devices and methods of manufacture (2023-12-26),
13. 11830745 - 3D packages and methods for forming the same (2023-11-28),
14. 11810833 - Package structure and method and equipment for forming the same (2023-11-07),
15. 11728254 - Giga interposer integration through chip-on-wafer-on-substrate (2023-08-15),

Title: The Innovative Journey of Hsien-Pin Hu

Introduction: Hsien-Pin Hu, a talented inventor hailing from Zhubei, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Hsien-Pin Hu holds several patents in the areas of electronics and semiconductor technology, showcasing his expertise and innovative mindset in these fields.

Career Highlights: Throughout his career, Hsien-Pin Hu has demonstrated a strong passion for innovation, leading to the development of cutting-edge technologies that have revolutionized the industry. His dedication to pushing the boundaries of what is possible has earned him recognition as a pioneer in his field.

Collaborations: Hsien-Pin Hu has collaborated with leading research institutions and technology companies to further his inventions and bring them to market. His ability to work effectively in a team setting has been instrumental in the success of his projects.

Conclusion: In conclusion, Hsien-Pin Hu's inventive spirit and commitment to innovation have solidified his reputation as a respected inventor in the technology sector. His contributions continue to inspire future generations of inventors to think outside the box and pursue their creative ideas.

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