The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Aug. 20, 2010
Hua-shu Wu, Hsinchu, TW;
Yu-hao Chien, Taipei, TW;
Shih-yung Chung, Jhubei, TW;
Li-tien Tseng, Bade, TW;
Yu-te Yeh, Taichung County, TW;
Hua-Shu Wu, Hsinchu, TW;
Yu-Hao Chien, Taipei, TW;
Shih-Yung Chung, Jhubei, TW;
Li-Tien Tseng, Bade, TW;
Yu-Te Yeh, Taichung County, TW;
Miradia Inc., Santa Clara, CA (US);
Abstract
A micro electro-mechanical (MEMS) device assembly is provided. The MEMS device assembly includes a first substrate that has a plurality of electronic devices, a plurality of first bonding regions, and a plurality of second bonding regions. The MEMS device assembly also includes a second substrate that is bonded to the first substrate at the plurality of first bonding regions. A third substrate having a recessed region and a plurality of standoff structures is disposed over the second substrate and bonded to the first substrate at the plurality of second bonding regions. The plurality of first bonding regions provide a conductive path between the first substrate and the second substrate and the plurality of the second bonding regions provide a conductive path between the first substrate and the third substrate.