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For the Inventor, By the Inventor

Tsukuba, Japan

Hirofumi Tanaka

This inventor holds 17 USPTO granted patents and 8 EPO patents, primarily in Semiconductor Technology. Top assignees: Mitsui Chemicals, Inc., Mitsu Chemicals, Inc., Nec Corporation. Active years: 1999-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hirofumi Tanaka. Retrieved from https://idiyas.com/inventor/hirofumi-tanaka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17

% Patents Active = 76.5

 

Average Co-Inventor Count = 3.8

ph-index = 2

Forward Citations = 22(Granted Patents)


Location History:

  • Kanagawa, JP (1999)
  • Chiba, JP (2013)
  • Sodegaura, JP (2015 - 2021)
  • Tsukuba, JP (2013 - 2024)

Company Filing History:

goldMedal14 out of 1,817 
 
Mitsui Chemicals, Inc.
 patents
silverMedal1 out of 6 
 
Mitsu Chemicals, Inc.
 patents
bronzeMedal1 out of 36,718 
 
Nec Corporation
 patents
4. 1 out of 7 
 
Rohn Co., Ltd.
 patents
5. 1 out of 8,782 
 
Sanyo Electric Co., Ltd.
 patents
6. 1 out of 448 
 
Ulvac, Inc.
 patents
where one patent can have more than one assignee

Years Active: 1999-2025

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Areas of Expertise:
Pellicle
Semiconductor Film Composition
Metal-Containing Film
Substrate Intermediary Body
Through-Hole Via Electrode
Sealing Composition
Filling Planarization Film
Porous Thin Film
Semiconductor Device
Rinsing Liquid
Composite Body
Interlayer Insulating Film
17 patents (USPTO):Explore Patents
1. 12353125 - Pellicle (2025-07-08),
2. 11965109 - Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor device (2024-04-23),
3. 11487205 - Semiconductor element intermediate, composition for forming metal-containing film, method of producing semiconductor element intermediate, and method of producing semiconductor element (2022-11-01),
4. 11209735 - Composition for forming metal-containing film, method of producing composition for forming metal-containing film, semiconductor device, and method of producing semiconductor device (2021-12-28),
5. 10950532 - Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method (2021-03-16),
6. 10759964 - Semiconductor film composition, method of manufacturing semiconductor film composition, method of manufacturing semiconductor member, method of manufacturing semiconductor processing material, and semiconductor device (2020-09-01),
7. 10752805 - Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor device (2020-08-25),
8. 10580639 - Sealing composition and method of manufacturing semiconductor device (2020-03-03),
9. 10043677 - Method for manufacturing filling planarization film and method for manufacturing electronic device (2018-08-07),
10. 10020238 - Method for manufacturing composite body and composition (2018-07-10),
11. 9780008 - Semiconductor device, method for manufacturing the same, and rinsing liquid (2017-10-03),
12. 9169353 - Sealing composition for semiconductor, semiconductor device and method of producing the same, and polymer and method of producing the same (2015-10-27),
13. 8956977 - Semiconductor device production method and rinse (2015-02-17),
14. 8603588 - Composition and method for production thereof, porous material and method for production thereof, interlayer insulating film, semiconductor material, semiconductor device, and low-refractive-index surface protection film (2013-12-10),
15. 8394457 - Precursor composition for porous thin film, method for preparation of the precursor composition, porous thin film, method for preparation of the porous thin film, and semiconductor device (2013-03-12),

Title: Hirofumi Tanaka: Innovator in Semiconductor Technology

Introduction

Hirofumi Tanaka is a prominent inventor based in Tsukuba, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 17 patents. His innovative work has paved the way for advancements in various applications within the semiconductor industry.

Latest Patents

Tanaka's latest patents include a novel tackifier solution designed to enhance solution stability. This invention aims to produce a pellicle with minimal tackifier residues and reduced outgas generation. The pellicle comprises a frame and a membrane, with a tackifier layer that contains a solidified resin composition. Additionally, he has developed a composition for forming films for semiconductor devices, which includes a compound with a Si—O bond and a cationic functional group, along with a specific crosslinking agent.

Career Highlights

Throughout his career, Hirofumi Tanaka has worked with notable companies such as Mitsui Chemicals, Inc. and Mitsu Chemicals, Inc. His expertise in semiconductor materials and processes has been instrumental in driving innovation within these organizations.

Collaborations

Tanaka has collaborated with esteemed colleagues, including Yasuhisa Kayaba and Shoko Ono. These partnerships have further enriched his research and development efforts in the semiconductor field.

Conclusion

Hirofumi Tanaka's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in semiconductor applications and materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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