The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

Mar. 11, 2014
Applicant:

Mitsui Chemicals, Inc., Minato-ku, Tokyo, JP;

Inventors:

Yasuhisa Kayaba, Sodegaura, JP;

Shoko Ono, Ichihara, JP;

Hirofumi Tanaka, Sodegaura, JP;

Tsuneji Suzuki, Chiba, JP;

Shigeru Mio, Chiba, JP;

Kazuo Kohmura, Iwakuni, JP;

Assignee:

MITSUI CHEMICALS, INC., Minato-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/29 (2006.01); C08L 79/02 (2006.01); H01L 21/02 (2006.01); C08K 5/00 (2006.01); C08G 73/02 (2006.01); C09J 179/04 (2006.01); H01L 21/56 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); C08G 73/0206 (2013.01); C08K 5/0091 (2013.01); C08L 79/02 (2013.01); C09J 179/04 (2013.01); H01L 21/0206 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/56 (2013.01); H01L 23/528 (2013.01); H01L 23/5329 (2013.01); H01L 23/53209 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Provided is a method for manufacturing a composite body, the method containing: a composition preparation process of preparing a composition that contains a polymer having a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000, and that has a pH of from 2.0 to 11.0; a composite member preparation process of preparing a composite member that includes a member A and a member B, a surface of the member B having a defined isoelectric point, and that satisfies a relationship: the isoelectric point of a surface of the member B< the pH of the composition<the isoelectric point of a surface of the member A; and an application process of applying the composition to the surface of the member A and the surface of the member B included in the composite member.


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