The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Mar. 24, 2016
Applicant:

Mitsui Chemicals, Inc., Minato-ku, Tokyo, JP;

Inventors:

Hirofumi Tanaka, Tsukuba, JP;

Yasuhisa Kayaba, Urayasu, JP;

Hiroko Wachi, Chiba, JP;

Koji Inoue, Ichihara, JP;

Shoko Ono, Ichihara, JP;

Assignee:

MITSUI CHEMICALS, INC., Minato-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/3105 (2006.01); C08G 73/02 (2006.01); C09D 179/02 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31051 (2013.01); C08G 73/0206 (2013.01); C09D 179/02 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/02343 (2013.01); H01L 21/02362 (2013.01); H01L 21/31058 (2013.01); H01L 21/31133 (2013.01);
Abstract

A method for manufacturing a filling planarization film, the method including: a first coating step of applying a first coating liquid, containing a polyamine and a first solvent, to a region including a recessed part of a member having the recessed part, to fill the first coating liquid into the recessed part; and a second coating step of applying a second coating liquid, containing an organic substance having two or more carboxyl groups and a second solvent having a boiling point of 200° C. or less and an SP value of 30 (MPa)or less, to the region including the recessed part of the member into which the first coating liquid has been filled.


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