logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10950532 B1

PDFFull Text
Date of Patent:
Mar. 16, 2021

Filed:

Dec. 14, 2015

Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method

Applicant:

Mitsui Chemicals, Inc., Tokyo, JP;

Inventors:

Yasuhisa Kayaba, Sodegaura, JP;

Shoko Ono, Ichihara, JP;

Hirofumi Tanaka, Sodegaura, JP;

Koji Inoue, Ichihara, JP;

Hiroko Wachi, Chiba, JP;

Assignee:

MITSUI CHEMICALS, INC., Tokyo, JP;

Attorney:

Buchanan, Ingersoll & Rooney PC

Primary Examiner:

Benjamin Tzu-Hung Liu

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/14 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 23/48 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/02164 (2013.01); H01L 21/02203 (2013.01); H01L 21/02216 (2013.01); H01L 21/02282 (2013.01); H01L 21/02362 (2013.01); H01L 21/486 (2013.01); H01L 21/76898 (2013.01); H01L 23/145 (2013.01); H01L 23/481 (2013.01); H01L 23/53295 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A substrate intermediary body includes: a substrate having a hole in a thickness direction, and a conductor being disposed in the hole; and an adhesion layer formed on a wall surface of the hole. The adhesion layer contains a reaction product of a polymer (A) having a cationic functional group and having a weight-average molecular weight of from 2,000 to 1,000,000 and a polyvalent carboxylic acid compound (B) having two or more carboxyl groups per molecule or a derivative thereof.

Find Patent Forward Citations

Kayaba, Yasuhisa. (2021). Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method (U.S. Patent No. 10950532). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10950532

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…