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For the Inventor, By the Inventor

Berlin, Germany

Ghassem Azdasht

This inventor holds 53 USPTO granted patents and 4 published patent applications and 20 EPO patents, primarily in Soldering Technologies (CPC class H01L). Top assignees: Pac Tech - Packaging Technologies Gmbh, Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v., Smart Pac Gmbh Technology Services. Active years: 1997-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ghassem Azdasht. Retrieved from https://idiyas.com/inventor/ghassem-azdasht

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 53 

% Patents Active = 92.5

 

Average Co-Inventor Count = 1.6

ph-index = 9

Forward Citations = 425(Granted Patents)

Forward Citations (Not Self Cited) = 393(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal35 out of 60 
 
Pac Tech - Packaging Technologies Gmbh
 patents
silverMedal9 out of 4,921 
 
Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v.
 patents
bronzeMedal8 out of 8 
 
Smart Pac Gmbh Technology Services
 patents
4. 1 out of 9,639 
 
Hewlett-Packard Company
 patents
5. 1 out of 27,667 
 
Hewlett-Packard Development Company, L.p.
 patents
6. 3 out of 834,453 
Other
 patents
where one patent can have more than one assignee

Years Active: 1997-2023

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Areas of Expertise:
Solder Ball Feeding
Laser Fusing
Chip Module Production
Bonding Material
Electrical Contacting
Solder Deposits
Microelectronics
Thermal Connection
Diode Array
Substrate Arrangement
Soldering Joint
Contact Arrangement
53 patents (USPTO):Explore Patents
1. 11618094 - Solder ball feeding device (2023-04-04),
2. 11554434 - Method and laser arrangement for fusing a solder material deposit by means of laser energy (2023-01-17),
3. 11224928 - Device for the separate application of solder material deposits (2022-01-18),
4. 10695853 - Device for the separate application of bonding material deposits (2020-06-30),
5. 10634699 - Device for removing a test contact of a test contact arrangement (2020-04-28),
6. 10354971 - Method for producing a chip module (2019-07-16),
7. 10286470 - Device for the separate application of connecting material deposits (2019-05-14),
8. 10118240 - Method for forming solder deposits (2018-11-06),
9. 10081068 - Device for the separate application of solder material deposits (2018-09-25),
10. 9685423 - Semiconductor chip assembly and method for manufacturing the same (2017-06-20),
11. 9649711 - Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux medium (2017-05-16),
12. 9401298 - Method and device for transferring a chip to a contact substrate (2016-07-26),
13. 9327360 - Method and device for contacting, positioning and impinging a solder ball formation with laser energy (2016-05-03),
14. 8988094 - Test contact arrangement (2015-03-24),
15. 8742571 - Diode array and method for producing a diode array (2014-06-03),

Title: Ghassem Azdasht: Innovator in Solder Technology

Introduction

Ghassem Azdasht is a distinguished inventor based in Berlin, Germany, known for his remarkable contributions to solder technology. With an impressive portfolio of 53 patents, his work focuses on enhancing the efficiency and effectiveness of soldering processes, which are crucial in various electronics applications.

Latest Patents

Among his latest innovations is the **Solder Ball Feeding Device**. This invention involves a sophisticated system that includes a solder ball reservoir and a metering device, which dispenses the precise amount of solder balls needed. Notably, the metering device employs ultrasound technology to apply vibrations to a dispensing nozzle, optimizing the feeding mechanism. Additionally, the device is designed to introduce pressurized gas, enhancing its operational efficiency.

Another noteworthy patent is the **Method and Laser Arrangement for Fusing a Solder Material Deposit by Means of Laser Energy**. This method utilizes two laser sources, each with varying power levels, to fuse solder material deposits effectively. The first laser source initiates the process, while a temperature sensor automatically transitions to the second laser for optimal results, ensuring precise control over the soldering temperature.

Career Highlights

Ghassem Azdasht has worked with notable companies, including Pac Tech Packaging Technologies GmbH. His experience in these organizations has significantly shaped his expertise in solder technology, enabling him to develop innovative solutions for complex soldering challenges.

Collaborations

Throughout his career, Ghassem has collaborated with talented colleagues such as Elke Zakel and Hans-Hermann Oppermann. These collaborations have fostered creative exchanges of ideas, further enhancing his contributions to the field of solder technology.

Conclusion

Ghassem Azdasht's dedication to innovation continues to influence the soldering industry. With a strong foundation of patents and collaborations, he remains an integral figure in advancing solder technology, demonstrating the importance of innovation in engineering and manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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