The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Oct. 23, 2014
Applicant:

Pac Tech—packaging Technologies Gmbh, Nauen, DE;

Inventor:

Ghassem Azdasht, Berlin, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/005 (2006.01); B23K 3/06 (2006.01); B23K 26/03 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0056 (2013.01); B23K 3/0623 (2013.01); B23K 26/034 (2013.01);
Abstract

The invention relates to a device () for the separate application of solder material deposits (), in particular solder balls, comprising a conveying device () for separately conveying the solder material deposits from a solder material reservoir () toward an application device (), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position Pin which the solder material deposit is exposed to a pressure gas, and from which the solder material deposit is transferred to an application opening of an application nozzle () of the application device into an application position Pwherein a detector device () is provided that serves to trigger a treatment of the solder material deposit arranged in the application position Pwith laser radiation emitted by a laser device, wherein the detector device has a reflection sensor () that detects reflection radiation () that is reflected by the solder material deposit arranged in the application position P


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